SEMI E185 - Specification for 300 mm Tape Frame FOUP -

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Non-Member Price: $180.00

Volume(s): Equipment Automation Hardware
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI E185-1222 - Current




The purpose of this Specification is to establish basic physical dimensions for the Tape Frame FOUP which is intended to be used to transport and store 300 mm tape frames, as specified by SEMI G74 and SEMI G87, within IC manufacturing facilities.


This Standard specifies the external features and dimensions of the Tape Frame FOUP. This Standard specifies the internal dimensions for storing the tape frames in the Tape Frame FOUP. This Standard specifies the areas to ensure automated installing and extracting the tape frames by end effectors. This Standard specifies the external dimensions of interfaces for automation tools which are designed for interacting with the Tape Frame FOUP.


Referenced SEMI Standards (purchase separately)

SEMI E57 — Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers

SEMI G74 — Specification for Tape Frame for 300mm Wafers

SEMI G87 — Specification for Plastic Tape Frame for 300mm Wafer

Revision History
SEMI E185-1222 (technical revision)
SEMI E185-1221 (first published)

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