SEMI E193 - Specification for 300 mm Film Frame FOUP (FFF) -

Abstract

NOTICE: This Standard does not follow normal formatting rules; it is being published with colored text in Table 1, ¶¶ 10.4.1, 10.4.1.2, 10.4.1.3, and Table 2.

1  Purpose
1.1  The purpose of this Specification is to establish basic physical dimensions for the film frame front opening unified pod (FOUP) which is intended to be used to transport and store 300 mm film frames, as specified by SEMI G74 and within integrated circuit manufacturing facilities.
2  Scope
2.1  This Standard specifies the external features and dimensions of the film frame FOUP (FFF).
2.2  This Standard specifies the internal dimensions for storing the film frames in the FFF.
2.3  This Standard specifies the areas to ensure automated insertion and removal of the film frames by end effectors.
2.4  This Standard specifies the external dimensions of interfaces for automation tools which are designed for interacting with the FFF.

Referenced SEMI Standards (purchase separately)
SEMI E1.9 — Mechanical Specification for Cassettes used to Transport and Store 300 mm Wafers
SEMI E47.1 — Mechanical Specification for FOUPs used to Transport and Store 300 mm Wafers
SEMI E57 — Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers
SEMI G74 — Specification for Tape Frame for 300 mm Wafers

Revision History
SEMI E193-0425 (first published)

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