SEMI E195 - Test Method Using Adhesive Replacement Substrates to Assess Particulate Surface Contamination on Critical Chamber Components -

Abstract

1  Purpose
1.1  This Test Method describes a quantitative analysis method to measure the ISO 14644-9 surface cleanliness for particle concentration (SCP) of a critical chamber component (CCC) by means of an adhesive replacement substrate (ARS), which removes particles from the CCC surfaces of interest. The ARS is subsequently measured with a scanning surface inspection system (SSIS), typically a scatterometer, for particle counting, and with scanning electron microscopy with energy dispersive x-ray spectrometry (SEM/EDX) to identify the elemental composition of the particles. 
1.2  This Test Method is intended to promote communication among the relevant parties (e.g., processing-equipment users, processing-equipment manufacturers, CCC manufacturers, cleaning-service providers, testing laboratories). This Test Method also can be used to facilitate better communication regarding particle-level expectations among the users, processing equipment manufacturers, the CCC manufacturers, and the cleaning-service providers.
1.3  The intended use of this Test Method is to ensure consistency in the measuring and reporting of results provided by each processing-equipment manufacturer or CCC manufacturer.
2  Scope
2.1  This Test Method applies to the measurement of the ISO 14644-9 SCP of a CCC (e.g., showerheads, pedestals, weldments, optical housings) by means of an ARS.

Referenced SEMI Standards (purchase separately)
SEMI E89 — Guide for Measurement System Analysis (MSA)
SEMI F63 — Guide for Ultrapure Water Used in Semiconductor Processing
SEMI M53 — Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodisperse Reference Spheres on Unpatterned Semiconductor Wafer Surfaces

Revision History
SEMI E195-0925 (first published)

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