SEMI F42 - Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing
This test method was technically approved by the global Facilities Committee and is the direct responsibility of the North American Facilities Committee. Current edition approved by the North American Regional Standards Committee on March 2 and April 10, 2000. Initially available on www.semi.org May 2000; to be published June 2000. Originally published June 1999.
NOTICE: This Document is no longer supported by the global technical committee. It has been replaced by SEMI F47.
The purpose of this document is to define the test method used to characterize the susceptibility of semiconductor processing, metrology, and automated test equipment to voltage sags.
This document defines the testing procedures and test equipment required to characterize the susceptibility of equipment to voltage sags by showing voltage sag duration and magnitude performance data for the equipment.
This test method is intended for, but not limited to, the following equipment types:
- Etch equipment (Dry and Wet)
- Film deposition equipment (CVD and PVD)
- Thermal equipment
- Surface prep and clean
- Photolithography equipment (Stepper and Tracks)
- Chemical Mechanical Polishing equipment
- Ion Implant equipment
- Metrology equipment
- Automated test equipment
Referenced SEMI Standards