F10700 - SEMI F107 - Guide for Process Equipment Adapter Plates

Volume(s): Facilities
Language: English
Type: Single Standards Download (.pdf)

This standard was technically approved by the global Facilities Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 13, 2008. It was available at www.semi.org in February 2009.


The purpose of the process equipment adapter plate guide is to provide guidance on the expectations and application for process equipment adapter plates. The use of adapter plates has been shown to reduce the time and cost associated with process equipment installation. Additionally, there is a potential for reduced floor space and facility connections to the equipment. The incorporation of adapter plates in the initial design of process equipment may benefit equipment suppliers and IC manufacturers.


This document establishes guidance for adapter plate design and installation. Adapter plates are subsystems of the process equipment and will conform to many of the design practices employed by primary system equipment suppliers.


This Guide is intended to address the application of adapter plates for process equipment cluster tools and single module process equipment whose installation requirements are typically complex (e.g., more than seven facility connections and more than three utility types, excluding power and communications). The adapter plates are used to support installation of the chassis rather than peripheral support equipment. This Guide’s focus is 300 mm and next generation wafer equipment requirements, but application to other wafer size equipment or non-wafer equipment may be appropriate and should be discussed by supplier and end-user.


It is intended that each adapter plate design will be unique for a particular process equipment type as determined by the equipment suppliers.


Referenced SEMI Standards

SEMI E6 — Guide for Semiconductor Equipment Installation Documentation

SEMI E49 — Guide for High Purity and Ultrahigh Purity Piping Performance, Subassemblies, and Final Assemblies

SEMI E70 — Guide for Tool Accommodation Process

SEMI E72 — Specification and Guide for 300 mm Equipment Footprint, Height and Weight

SEMI E76 — Guide for 300mm Process Equipment Points of Connection to Facility Services

SEMI S2 — Environmental, Health and Safety Guideline for Semiconductor Manufacturing Equipment

SEMI S22 — Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment

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