SEMI F115 - Test Method for the Determination of Metallic Elements Present on Wetted Surfaces of Ultra High Purity Chemical Delivery Systems and Components
This Document defines a test method for determining metallic elements present on the wetted surfaces of ultra high purity (UHP) chemical delivery systems and components.
This Test Method is applicable to UHP chemical delivery systems and components. Examples of test samples include valves, regulators, filters, mass flow controllers, tubing, weld fittings, and face seal fittings.
This Test Method could also be used to determine the contamination contributed from an assembly or fabrication area.
This Document details the method to extract and measure ultrapure water (UPW) extractable metallic elements present on the wetted surfaces.
This Test Method could be used to evaluate the effectiveness of various flushing or purging processes.
Referenced SEMI Standards
SEMI E49.2 — Guide for the Qualification of Polymer Assemblies used for Liquid Chemicals Systems in Semiconductor Equipment
SEMI E49.8 — Guide for High Purity and Ultrahigh Purity Gas Distribution Systems in Semiconductor Manufacturing Equipment
SEMI F20 — Specification for 316L Stainless Steel Bar, Forgings, Extruded Shapes, Plate, and Tubing for Components Used in General Purpose, High Purity and Ultra-High Purity Semiconductor Manufacturing Applications
SEMI F63 — Guide for Ultrapure Water Used in Semiconductor Processing
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