SEMI F122 - Guide for Facilities Data Package for Manufacturing Equipment Installation and Building Information Modeling -

Abstract

1  Purpose
1.1  This Guide suggests formats for the facilities data package (FDP) typically required for the installation of manufacturing equipment in a facility. The data and formats suggested by this Guide complement other SEMI Standards (e.g., SEMI E6), and include the utility requirements and connections information needed for installing manufacturing equipment (including support equipment) and connecting that equipment to the facility and connecting physically separate modules of equipment to each other.
1.2  This data and formats in this Guide also support building information modeling (BIM). The FDP has historically not included BIM.
2  Scope
2.1  This Guide identifies and suggests formats for reporting basic facilities building information model (BIM) and facilities data typically required to plan, prepare, model, and optimize a facility for the installation of manufacturing equipment.
2.2  This Guide includes information related to interconnections between pieces of manufacturing equipment as well as the facility connections to the manufacturing equipment.
2.3  This Guide recommends an equipment installation FDP containing documents covering equipment installation from layout planning and facility design, through equipment installation and hook-up. It describes the physical and digital objects to be delivered to the customer.
2.4  This Guide describes common items that may be used by the semiconductor manufacturers to create simulation programs for optimization of a facility.
2.5  This Guide describes a series of data sheets documenting utilities necessary to support manufacturing equipment. The data sheets provide a consistent format for both the equipment supplier and equipment purchaser to use in compiling and interpreting equipment installation data.

Referenced SEMI Standards (purchase separately)
SEMI E6 — Guide for Semiconductor Equipment Installation Documentation
SEMI E72 — Specification and Guide for Equipment Footprint, Height, and Weight
SEMI E76 — Guide for 300mm Process Equipment Points of Connection to Facility Services
SEMI E84 — Specification for Enhanced Carrier Handoff Parallel I/O Interface
SEMI S2 — Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI S8 — Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment

Revision History
SEMI F122-0225 (first published)

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