From Wafer to Chip - The Basics of Semiconductor Manufacturing 7/9

From Wafer to Chip - The Basics of Semiconductor Manufacturing 7/9

Member Price:  $149.00
Non-Member Price:  $179.00
From Wafer to Chip - The Basics of Semiconductor Manufacturing 
 
Dates & Times
 
8:00 am - 12:00 pm PDT
 
 
Location
Virtual Training
 
Pricing
 
Members:  $149
Non-Members:   $179
 
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 
 
The course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
 

Learning Objectives:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.
 

Topics Included:

  • Module 1: Semiconductor Fundamentals - Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function. 
  • Module 2: Semiconductor Terminologies and Manufacturing Context -Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussion with confidence.
  • Module 3 Front-end and Back-end Semiconductor Manufacturing - Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging and testing processes.
  • Module 4: Transistors and Their Operations- Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside circuits.

Who Should Attend:

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, business individuals, and anyone wanting to learn more about the semiconductor industry. 
 
Cancellation and Rescheduling Policies   
·         Registrants may cancel or reschedule a class no less than 30 days before the class start date. 
·       Cancellations received after the stated deadline will not be eligible for a refund.
·       Cancellations will be accepted via email to semiu-support@semi.org
·        The registrant or the credit card holder must make all refund requests.
·       Refund requests must include the attendee's name, Course Name, and session date.     
·       Refunds will be credited to the original payment method used for payment.
·       SEMI reserves the right to cancel any course due to low enrollment or other circumstances that would make the event unavailable 7 business days before the class's start date.
·       If SEMI cancels a class, the registrants will be offered a full refund. 

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