Japan Store
Front of Line Assembly
Course Description
The semiconductor industry provides critical enabling technology for many products and fields and has seen periods of rapid growth. While electronic goods dominate the market, communications, medical devices, and the automotive industry show signs of increased potential.
This course provides an overview of front-of-line packaging assembly, not including interconnect technologies. This course will share key package assembly technologies of back grinding, dicing, and die attach devices for semiconductor packaging. Those interested in the front-end package assembly process will learn these technologies inclusive of their various processes, materials, and future direction to meet the semiconductor application needs.
Learning Objectives:
- Understand the relationship between the back-grinding wheel and subsurface damage.
- Discuss back-grinding equipment and its key parameters for back-grinding.
- Explain mechanical dicing and its key properties to dicing quality.
- Compare the advantages and challenges of dicing technologies.
- Discuss epoxy die attach and its material properties for applications.
- Identify factors affecting die attach quality.
Course Duration
75 minutes
Target Audience
Sales engineers/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, and IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready.
Requisite Knowledge
At least some college-level scientific knowledge
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