G00100 - SEMI G1 - 仕様Cer-DIPパッケージ構造

Volume(s): Packaging
Language: Japanese
Type: Single Standards Download (.pdf)





· 2枚のセラミック片,つまり,ベースとウィンドウフレーム間に挟まれて,さらに,はんだガラス層で封止されたリードフレームと,同様の封止材を持つキャップ

· セラミックベース上のはんだガラス中に取り付けられたリードフレームと,同様のガラス封止層を持つキャップ

Referenced SEMI Standards

SEMI G2 — Specification Metallic Leadframes for Cer-Dip Packages
SEMI G20 — Specification Lead Finishes for Plastic Packages (Active Devices only)
SEMI G23 — Test Method Measuring the Inductance of Package Leads
SEMI G24 — Test Method Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
SEMI G25 — Test Method Measuring the Resistance of Package Leads
SEMI G30 — Test Method Junction-to-Case Thermal Resistance Measurements of Ceramic Packages

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