SEMI G1 - Specification for Cerdip Package Constructions -

Abstract

NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

 

This Specification defines the materials and acceptance criteria for the components (bases, window frames, and caps) or subassemblies (leadframes mounted in a sandwich between bases and window frames) used for cerdip package constructions.

This Specification applies to all cerdip (dual-in-line) packages which have either:

• A leadframe sandwiched between two ceramic pieces—the base and a window frame—and sealed by a solder glass layer, and a cap with a similar seal; or,

• A leadframe mounted into a solder glass layer on a ceramic base, and a cap with a similar glass seal layer.

 

Referenced SEMI Standards (purchase separately)

SEMI G2 — Specification Metallic Leadframes for Cer-Dip Packages

SEMI G20 — Specification Lead Finishes for Plastic Packages (Active Devices only)

SEMI G23 — Test Method Measuring the Inductance of Package Leads

SEMI G24 — Test Method Measuring the Lead-to-Lead and Loading Capacitance of Package Leads

SEMI G25 — Test Method Measuring the Resistance of Package Leads

SEMI G30 — Test Method Junction-to-Case Thermal Resistance Measurements of Ceramic Packages

 

Revision History

SEMI G1-96 (technical revision)

SEMI G1-90 (technical revision)

SEMI G1-86 (first published)

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