SEMI G1 - Specification for Cerdip Package Constructions

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract
This specification defines the materials and acceptance criteria for the components (bases, window frames, and caps) or sub-assemblies (leadframes mounted in a sandwich between bases and window frames) used for cerdip package constructions.

 

Referenced SEMI Standards

SEMI G2 — Specification Metallic Leadframes for Cer-Dip Packages
SEMI G20 — Specification Lead Finishes for Plastic Packages (Active Devices only)
SEMI G23 — Test Method Measuring the Inductance of Package Leads
SEMI G24 — Test Method Measuring the Lead-to-Lead and Loading Capacitance of Package Leads
SEMI G25 — Test Method Measuring the Resistance of Package Leads
SEMI G30 — Test Method Junction-to-Case Thermal Resistance Measurements of Ceramic Packages

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