SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1994; previously published March 2002.

 

NOTICE: This Document was reapproved with minor editorial changes.

 

This Specification covers the special requirements for a metal strip to be used to fabricate integrated circuit leadframes by stamping.

 

 

Referenced SEMI Standards

None.

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