SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1994; previously published March 2002.
NOTICE: This Document was reapproved with minor editorial changes.
This Specification covers the special requirements for a metal strip to be used to fabricate integrated circuit leadframes by stamping.
Referenced SEMI Standards