SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at and in August 2011; originally published in 1994; previously published March 2002.


NOTICE: This Document was reapproved with minor editorial changes.


This Specification covers the special requirements for a metal strip to be used to fabricate integrated circuit leadframes by stamping.



Referenced SEMI Standards


Member Price: $113.00
Regular price Non-Member Price: $150.00