G00900 - SEMI G9 - 仕様 スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム

Volume(s): Packaging
Language: Japanese
Type: Single Standards Download (.pdf)



Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G10 — Standard Method of Mechanical Measurement
SEMI G21 — Specification for Plating Integrated Circuit Leadframes

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