SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages -

Member Price: $130.00
Non-Member Price: $170.00

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G9-89 - Inactive



NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.


This Specification is a guideline for the stamping manufacture of leadframes for plastic molded dual-in-line semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers and mold manufacturers, and has been developed to meet the requirements of automatic bonding.


Referenced SEMI Standards (purchase separately)

SEMI G4 — Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes

SEMI G10 — Standard Method of Mechanical Measurement

SEMI G21 — Specification for Plating Integrated Circuit Leadframes


Revision History

SEMI G9-89 (technical revision)

SEMI G9-86 (technical revision)

SEMI G9-84 (technical revision)

SEMI G9-80 (first published)

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