SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract
This specification is a guideline for the stamping manufacture of leadframes for plastic molded dual-in-line semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers and mold manufacturers, and has been developed to meet the requirements of automatic bonding.

 

Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G10 — Standard Method of Mechanical Measurement
SEMI G21 — Specification for Plating Integrated Circuit Leadframes

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