SEMI G10 - Standard Method for Mechanical Measurement of Plastic Package Leadframes -

Abstract

NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

 

This method outlines standard mechanical measurement techniques for cut strip leadframes.

This method applies to all facilities that perform mechanical measurements on leadframes. Information is provided herein to enable the use of the following specifications: SEMI G9, SEMI G27, and SEMI G28.

 

Referenced SEMI Standards (purchase separately)

SEMI G9 — Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages

SEMI G27 — Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages

SEMI G28 — Specification for Leadframes for Plastic Molded S.O. Packages

 

Revision History

SEMI G10-96 (Reapproved 0811)

SEMI G10-96 (technical revision)

SEMI G10-86 (technical revision)

SEMI G10-83 (first published)

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