SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds
This method describes a procedure for measuring the flow and gel characteristics of semiconductor grade transfer molding compounds using a ram follower device.
Referenced SEMI Standards
|Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.|
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.