SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds -

Abstract

1  Purpose
1.1  This Practice defines a procedure for measuring the flow and gel characteristics of semiconductor grade transfer molding compounds using a ram follower device.
2  Scope
2.1  This Practice can be applied to the mold resins which are used for packaging.
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Referenced SEMI Standards (purchase separately)
None
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

Revision History
SEMI G11-0519 (Reapproved 0526)
SEMI G11-0519 (technical revision)
SEMI G11-88 (Reapproved 0811)
SEMI G11-88 (first published)

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