G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds

SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds -

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Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G11-0519 - Current

Revision

Abstract

 

This method describes a procedure for measuring the flow and gel characteristics of semiconductor grade transfer molding compounds using a ram follower device.

 

　

Referenced SEMI Standards

None.

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