G01300 - SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds

SEMI G13 - Test Method for Thermal Expansion Characteristics of Molding Compounds -

Member Price: $138.00
Non-Member Price: $180.00

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G13-1122 - Current

Revision

Abstract

 

The thermal expansion ratio and glass transition temperature of molding compounds are the key characteristics which effects the productivity and reliability of the plastic packages. The purpose of this Test Method is to determine procedures for thermal expansions characteristics of molding compound.

This Test Method describes the procedure for measuring the coefficient of thermal expansion (CTE) and glass transition temperature (Tg) of thermosetting molding compounds.
 

Referenced SEMI Standards (purchase separately)
None.

 

Revision History
SEMI G13-1122 (technical revision)
SEMI G13-88 (Reapproved 0811)
SEMI G13-88 (technical revision)
SEMI G13-84 (technical revision)
SEMI G13-81 (first published)

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