SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract
This document is a guideline for the ordering of tooling required to mold and form plastic molded DIP semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line tool makers as the basis for defining the limits of manufacturing tolerances.

 

Referenced SEMI Standards

None.

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