SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at and in March 2018; originally published in 1984; previously published in August 2011.


This Specification is for the leadframe material that will be shipped to an etch house. It is a leadframe specification, but deals with material aspects only.


This Specification covers the special requirements for metal strip to be used to fabricate integrated circuit leadframes by etching.


Referenced SEMI Standards


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