SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018; originally published in 1984; previously published in August 2011.

 

This Specification is for the leadframe material that will be shipped to an etch house. It is a leadframe specification, but deals with material aspects only.

 

This Specification covers the special requirements for metal strip to be used to fabricate integrated circuit leadframes by etching.

 

Referenced SEMI Standards

None.

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