SEMI G19 - Specification for Dip Leadframes Produced by Etching

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at and in August 2011; originally published in 1980; previously published September 1997.


This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers and has been developed to meet the requirements of automatic bonders.



Referenced SEMI Standards

SEMI G10 — Standard Method for Mechanical Measurement of Plastic Package Leadframes

SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

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