SEMI G19 - Specification for Dip Leadframes Produced by Etching
This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1980; previously published September 1997.
This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers and has been developed to meet the requirements of automatic bonders.
Referenced SEMI Standards
SEMI G10 — Standard Method for Mechanical Measurement of Plastic Package Leadframes
SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes