G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.


This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers and has been developed to meet the requirements of automatic bonders.


Referenced SEMI Standards (purchase separately)

SEMI G10 — Standard Method for Mechanical Measurement of Plastic Package Leadframes

SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes


Revision History

SEMI G19-0997 (Reapproved 0811)

SEMI G19-0997 (technical revision)

SEMI G19-84 (first published)

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