SEMI G21 - Specification for Plating Integrated Circuit Leadframes

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 8, 2016. Available at www.semiviews.org and www.semi.org in March 2017; originally published in 1980; previously published in 1994.

 

This Document specifies the requirements for plating layers on leadframes intended for use at the upcoming inspection.

 

The specifications and test procedures detailed in this Document apply to the internal section of leadframes. External leadframe finishes are not included.

 

Referenced SEMI Standards

SEMI G4 — Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes
SEMI G18 — Materials Used in the Production of Etched Leadframes for Semiconductor Devices

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