G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes
NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.
This Standard specifies the requirements for plating layers on leadframes intended for use at the upcoming inspection.
The specifications and test procedures detailed in this Standard apply to the internal section of leadframes. External leadframe finishes are not included.
Referenced SEMI Standards (purchase separately)
SEMI G4 — Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes
SEMI G18 — Materials Used in the Production of Etched Leadframes for Semiconductor Devices
SEMI G21-0317 (technical revision)
SEMI G21-94 (technical revision)
SEMI G21-84 (first published)
|Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.|
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.