SEMI G21 - Specification for Plating Integrated Circuit Leadframes -

Abstract

NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

 

This Standard specifies the requirements for plating layers on leadframes intended for use at the upcoming inspection.

The specifications and test procedures detailed in this Standard apply to the internal section of leadframes. External leadframe finishes are not included.

 

Referenced SEMI Standards (purchase separately)

SEMI G4 — Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes

SEMI G18 — Materials Used in the Production of Etched Leadframes for Semiconductor Devices

 

Revision History

SEMI G21-0317 (technical revision)

SEMI G21-94 (technical revision)

SEMI G21-84 (first published)

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