SEMI G25 - Test Method for Measuring the Resistance of Package Leads -

Abstract

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1984; previously published in 1989.

 

This Document defines the equipment, materials, and procedure used to measure the resistance of leads in packaging elements. This Document uses a pin grid (cavity down) package as one example of the type of packaging element that can be measured with the method described herein; however, this measurement technique can be applied to other geometrics with proper consideration.

 

　

Referenced SEMI Standards

None.

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