SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
Volume(s):
Packaging
Language:
English
Type:
Single Standards Download (.pdf)
Abstract
This specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0.050" pad centerline. The SLAM package is covered separately in SEMI G5.
Referenced SEMI Standards
None.
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