SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
Volume(s):
Packaging
Language:
English
Type:
Single Standards Download (.pdf)
Abstract
This specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0.050" pad centerline. The SLAM package is covered separately in SEMI G5.
Referenced SEMI Standards
None.
Related Products
 |
Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards. |
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.
Member Price:
$113.00
Regular price
Non-Member Price:
$150.00