SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract
This specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0.050" pad centerline. The SLAM package is covered separately in SEMI G5.

 

Referenced SEMI Standards

None.

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