SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids -
Abstract
This specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0.050" pad centerline. The SLAM package is covered separately in SEMI G5.Referenced SEMI Standards
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G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids
Sale price$150.00 USD
Regular price$150.00 USD (/)
