G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages

SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages -

Member Price: $144.00
Non-Member Price: $150.00

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
SEMI Standards Copyright Policy/License Agreements

Revision: Default Title

Revision

Abstract

This specification is a guideline for high volume production of leadframes for plastic leaded chip carrier semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers, and mold manufacturers, and has been developed to meet the requirements of automatic assemblers.

　

Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Material
SEMI G10 — Standard Method of Mechanical Measurement for Leadframes
SEMI G18 — Specification, Integrated Circuit Leadframe Materials Used in the Production of Etched Leadframes
SEMI G21 — Specification, Plating Integrated Circuit Leadframes

Interested in purchasing additional SEMI Standards?

Consider SEMIViews, an online portal with access to over 1000 Standards.

Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.

You May also Like