G02800 - SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様

Volume(s): Packaging
Language: Japanese
Type: Single Standards Download (.pdf)

本スタンダードは,global Assembly & Packaging Technical Committeeで技術的に承認されている。現版は201171日,global Audits and Reviews Subcommitteeにて発行が承認された。20118月にwww.semiviews.orgおよび www.semi.orgで入手可能となる。初版は1986年発行。前版は19979月発行。


注意: 本文書は,編集上の修正を伴い再承認された。




Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes

SEMI G9 — Specification for Stamped Leadframes for Plastic Molded Dual-In-Line Semiconductor Packages

SEMI G10 — Standard Method for Mechanical Measurement for Plastic Package Leadframes

SEMI G21 — Specification for Plating Integrated Circuit Leadframes

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