SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages -

Abstract

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1986; previously published September 1997.

 

This Specification defines the acceptance criteria for stamped leadframes for plastic molded S.O. packages.

 

　

Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes

SEMI G9 — Specification for Stamped Leadframes for Plastic Molded Dual-In-Line Semiconductor Packages

SEMI G10 — Standard Method for Mechanical Measurement for Plastic Package Leadframes

SEMI G21 — Specification for Plating Integrated Circuit Leadframes

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