SEMI G30 - Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages -

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Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G30-88 - Superseded



This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on July 1, 2011. Available at and in August 2011; originally published in 1986; previously published in 1988.


NOTICE: This Document was reapproved with minor editorial changes.


The purpose of this test is to determine the thermal resistance of ceramic packages using thermal test chips. This test method deals only with junction-to-case or mounting surface measurements of thermal resistance and limits itself to heat sink and fluid bath testing environments. Following the guidelines outlined in this test method, junction-to-case thermal resistance measurements of ceramic packages using the heat sink and fluid bath methods should give the same results only under certain limited conditions (i.e., under conditions that approximate unidirectional heat flow through the chip and substrate to the preferred heat removal surface). If discrepancies occur, the heat sink mounting technique shall be considered as the referee test method. The heat sink mounting method for measuring junction-to-case thermal resistance will be a conservative measure of the package’s ability to transfer heat to the ambient environment because heat sinking is provided only on one side of the package, whereas the fluid bath mounting method has the potential for equally cooling both sides of the package.



Referenced SEMI Standards


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