SEMI G32 - Guideline for Unencapsulated Thermal Test Chip -

Abstract

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1994.

 

NOTICE: This Document was reapproved with minor editorial changes.

 

This Guideline details recommendations for a standardized thermal test chip design for referee test purposes. A sample data format for the test chip can be found in Appendix 1. Based on the results of computer simulations of various chip-substrate configurations, the following recommendations are made for the design of thermal test chips for VLSI package characterization.

 

　

Referenced SEMI Standards

None.

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