G03300 - SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages

SEMI G33 - Specification for Pressed Ceramic Pin Grid Array Packages -

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Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Abstract

This specification defines the acceptance criteria for ceramic pin grid array packages produced utilizing pressed ceramic, mechanically inserted pins and solder for electrical interconnection of pins.

　

Referenced SEMI Standards

None.

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