SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract
This specification establishes uniform methods and procedures for conducting tests on lead finishes on (active device) electronic packages. Other SEMI Standards establish materials used and the finishes for them.

 

Referenced SEMI Standards

SEMI G4 — Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G18 — Integrated Circuit Leadframe Materials Used in the Production of Etched Leadframes
SEMI G20 — Lead Finishes for Plastic Packages (Active Devices Only)

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