SEMI G35 - Specification for Test Methods for Lead Finishes on Semiconductor (Active) Devices

This specification establishes uniform methods and procedures for conducting tests on lead finishes on (active device) electronic packages. Other SEMI Standards establish materials used and the finishes for them.

　

Referenced SEMI Standards

SEMI G4 — Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G18 — Integrated Circuit Leadframe Materials Used in the Production of Etched Leadframes
SEMI G20 — Lead Finishes for Plastic Packages (Active Devices Only)

Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.

Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.