SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018; originally published in 1987; previously published August 2011.
The purpose of this Test Method is to determine the thermal resistance of integrated circuit packages using thermal test chips.
This Test Method deals only with junction-to-ambient measurements of thermal resistance and limits itself to still- and forced-air convection testing environments.
Referenced SEMI Standards
SEMI G32 — Guideline for Unencapsulated Thermal Test Chip
SEMI G42 — Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages