SEMI G38 - Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages -

Abstract

NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

The purpose of this Test Method is to determine the thermal resistance of integrated circuit packages using thermal test chips.

This Test Method deals only with junction-to-ambient measurements of thermal resistance and limits itself to still- and forced-air convection testing environments.

Referenced SEMI Standards (purchase separately)
SEMI G32 — Guideline for Unencapsulated Thermal Test Chip
SEMI G42 — Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages

Revision History
SEMI G38-0318 (technical revision)
SEMI G38-0996 (Reapproved 0811)
SEMI G38-0996 (Reapproved 1104)
SEMI G38-0996 (technical revision)
SEMI G38-87 (first published)

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