SEMI G41 - Specification for Dual Strip SOIC Leadframe -

Abstract

NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

 

This Specification is a guideline for high volume production of leadframes, including internal package plating, for plastic molded Single Outline Integrated Circuit (SOIC) semiconductor packages.

This Specification is used by packaging engineers, leadframe manufacturers and mold manufacturers. This Specification is designed to meet the requirements of automated assembly.

 

SOIC Dual Standard Dimensions is described for narrow body of 0.150 in. width and wide body of 0.300 in. width. See Table 1, and Figures 7 through 14. The unit in these figures is inch.

 

Referenced SEMI Standards (purchase separately)

SEMI G4 — Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes

SEMI G10 — Mechanical Measurement for Plastic Package Leadframes

 

Revision History

SEMI G41-0317 (technical revision)

SEMI G41-87 (first published)

Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.