SEMI G41 - Specification for Dual Strip SOIC Leadframe

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on December 8, 2016. Available at and in March 2017; originally published in 1987.


This Specification is a guideline for high volume production of leadframes, including internal package plating, for plastic molded Single Outline Integrated Circuit (SOIC) semiconductor packages.


This Document is used by packaging engineers, leadframe manufacturers and mold manufacturers. This Document is designed to meet the requirements of automated assembly.


SOIC Dual Standard Dimensions is described for narrow body of 0.150 inch width and wide body of 0.300 inch width. See Table 1, and Figures 7 through 14. The unit in these figures is inch.


Referenced SEMI Standards

SEMI G4 — Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes
SEMI G10 — Mechanical Measurement for Plastic Package Leadframes

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