SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018; originally published in 1986; previously published August 2011.
This Document provides the requirements for a standard thermal resistance test board to be used in junction-to-ambient thermal resistance measurement of a semiconductor package under still- and forced-air condition as a referee method.
This Document describes the thermal resistance test board for measurement of the following packages:
• Dual-In-Line Packages (DIP),
• Plastic Chip Carrier Package (PCC),
• Quad Flat Package (QFP),
• Pin Grid Array Package (PGA), and
•Ball Grid Array Package (BGA).
This Document uses SI units.
Referenced SEMI Standards
SEMI G32 — Guideline for Unencapsulated Thermal Test Chip
SEMI G38 — Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages