SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018; originally published in 1986; previously published August 2011.

 

This Document provides the requirements for a standard thermal resistance test board to be used in junction-to-ambient thermal resistance measurement of a semiconductor package under still- and forced-air condition as a referee method.

 

This Document describes the thermal resistance test board for measurement of the following packages:

• Dual-In-Line Packages (DIP),

• Plastic Chip Carrier Package (PCC),

• Quad Flat Package (QFP),

• Pin Grid Array Package (PGA), and

•Ball Grid Array Package (BGA).

 

This Document uses SI units.

 

Referenced SEMI Standards

SEMI G32 — Guideline for Unencapsulated Thermal Test Chip
SEMI G38 — Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages

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