SEMI G43 - Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages -

Abstract

The purpose of this test is to determine the thermal resistance of molded plastic packages using thermal test chips. This Test Method deals only with junction-to-case measurements of thermal resistance and limits itself to fluid bath testing environments. For this test, conduction through the leads is minimized, thus providing information on the ability of the plastic package material to dissipate heat.

This Test Method should only be used for comparing the thermal characteristics of plastic packages in the same fluid bath system due to the thermophysical properties of the heat transfer fluids used and the effects of the variable nature of the fluid-stirring and package-mounting procedures.

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