G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling

SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling -

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Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Abstract

This document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i.e., DIPS, SIPS, PCC, SO, Quad, and TAB).

　

Referenced SEMI Standards

SEMI G14 — Plastic Molded DIP Tooling
SEMI G16 — Plastic Chip Carrier Tooling
SEMI G36 — Plastic Molded High Density TAB Quad Tooling
SEMI G37 — Plastic Molded SO Package Tooling

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