SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions
Type: Single Standards Download (.pdf)
This specification defines the standard requirements for co-fired ceramic fine pitch chip carrier constructions, including both top brazed leaded and top metallized leadless configurations. These constructions are for hermetic packaging of various devices, (e.g., high speed, digital VLSI silicon devices), and next-level interconnection to printed wiring assemblies and modules by either lead solder attachment or by "leads last" techniques.
Referenced SEMI Standards
|Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards.|
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.
Member Price: $113.00
Regular price Non-Member Price: $150.00