SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes -

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Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G51-90 (Reapproved 0811) - Inactive



This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at and in August 2011; originally published in 1990.


NOTICE: This Document was reapproved with minor editorial changes.


This Specification defines the acceptance criteria for leadframes designed for assembly of JEDEC proposed registered Publication 95 Standard Outlines for the Metric Quad Flat Pack Family Packages. It is a design guideline for packaging engineers, leadframe stampers and etchers, and mold and trim/form tooling manufacturers. It has been developed to meet the requirements of assemblers using automatic and manual equipment.



Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Frames

SEMI G10 — Standard Method for Mechanical Measurement of Plastic Package Leadframes

SEMI G18 — Standard for Integrated Circuit Leadframe Material Used in the Production of Etched Frames

SEMI G21 — Specification for Plating Integrated Circuit Leadframes

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