SEMI G53 - Specification for Metal Lid/Preform Assembly

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract
This specification provides guidelines for the design and acceptance of metal lid/preform assemblies. This specification may be used by suppliers at outgoing inspection and by the customers at incoming inspection. The design and acceptance criteria may be used for metal lid/preform assemblies used on all types of semiconductor packages. Improper lid/preform design and poorly specified lid/preforms contributes to low sealing yields and unreliable devices.

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Referenced SEMI Standards

None.

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