SEMI G56 - Test Method for Measurement of Silver Plating Thickness

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018; originally published in 1993; previously published August 2011.

Use — This Test Method may be used for process control and outgoing inspection at the supplier or by the customer for incoming inspection.

Units — This standard Test Method uses SI units.

This Test Method describes the standard method for measuring the thickness of silver plating on semiconductor leadframes.

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