
SEMI G56 - Test Method for Measurement of Silver Plating Thickness -
Abstract
1 Purpose
1.1 Use — This Test Method may be used for process control and outgoing inspection at the supplier or by the customer for incoming inspection.
1.2 Units — This Test Method uses SI units.
2 Scope
2.1 This Test Method describes the standard method for measuring the thickness of silver plating on semiconductor leadframes.
Referenced SEMI Standards (purchase separately)
None.
Revision History
SEMI G56-0318 (technical revision)
SEMI G56-93 (Reapproved 0811)
SEMI G56-93 (Reapproved 0302)
SEMI G56-93 (first published)
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