SEMI G56 - Test Method for Measurement of Silver Plating Thickness -

Member Price: $144.00
Non-Member Price: $187.00

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G56-0318 - Inactive

Revision

Abstract

 

1  Purpose
1.1  Use — This Test Method may be used for process control and outgoing inspection at the supplier or by the customer for incoming inspection.
1.2  Units — This Test Method uses SI units.
2  Scope
2.1  This Test Method describes the standard method for measuring the thickness of silver plating on semiconductor leadframes.

 

Referenced SEMI Standards (purchase separately)
None.

 

Revision History
SEMI G56-0318 (technical revision)
SEMI G56-93 (Reapproved 0811)
SEMI G56-93 (Reapproved 0302)
SEMI G56-93 (first published)

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