SEMI G57 - Guide for Standardization of Leadframe Terminology

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 6, 2015. Available at www.semiviews.org and www.semi.org in October 2015; originally published in 1993; previously published March 2002.

NOTICE: This Document was reapproved with minor editorial changes.

This Guide defines standard terminologies for all the features of leadframes used in the production of semiconductor circuits.

Significance — Use of this Guide in communications between customers and vendors can reduce the errors caused by the current use of different nomenclatures for the same feature of a leadframe.

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