SEMI G63 - Test Method for Measurement of Die Shear Strength -

Abstract

The purpose of this Test Method is to determine procedures for die shear strength testing.

This Test Method shall be used for the measurement of the die shear strength when die attach paste/film is used to bond a die to a leadframe/substrate bond pad.

This Test Method shall be used for quality control and development at die attach paste/film suppliers and for incoming inspection and selection of the die attach paste/film at die attach paste/film users. Depending on adding die attach material (DAF), add the measurement conditions and several chip sizes for test vehicle.

This Test Method can be applicable to die attach material besides paste/film material and may be used to evaluate leadframe/substrate bond pad quality.

Referenced SEMI Standards (purchase separately)
None.

Revision History
SEMI G63-1122 (technical revision)
SEMI G63-95 (Reapproved 0811)
SEMI G63-95 (Reapproved 0302)
SEMI G63-95 (first published)

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