SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) -

Abstract

This Specification is intended as a guideline for evaluating plating layer characteristics required by users of full-plated leadframes for plastic semiconductor packages.

Background — Full-plated leadframes have received attention in recent years as a possible solution to challenges and restrictions resulting from the effects of Pb on the environment, package reliability improvement due to the P.P.F. process, lead coplanarity on fine-pitched leadframes, and lead bridges with solder plating.

The specification and test procedures detailed in this Standard apply to full-plated leadframes.
 

Referenced SEMI Standards (purchase separately)
SEMI G52 — Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes

Revision History
SEMI G64-1118 (Reapproved 1123)
SEMI G64-1118 (technical revision)
SEMI G64-96 (Reapproved 0811)
SEMI G64-96 (Reapproved 1104)
SEMI G64-96 (first published)

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