SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd) -

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Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G64-1118 - Current



This Standard was technically approved by the 3D Packaging and Integration Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 6, 2018. Available at and in November 2018; originally published in 1996; previously published August 2011.


This Specification is intended as a guideline for evaluating plating layer characteristics required by users of full-plated leadframes for plastic semiconductor packages.


Background — Full-plated leadframes have received attention in recent years as a possible solution to challenges and restrictions resulting from the effects of Pb on the environment, package reliability improvement due to the P.P.F. process, lead coplanarity on fine-pitched leadframes, and lead bridges with solder plating.


The specification and test procedures detailed in this Document apply to full-plated leadframes.


Units — SI units are used in this Document.


Referenced SEMI Standards

SEMI G4 — Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes
SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
SEMI G21 — Specification for Plating Integrated Circuit Leadframes
SEMI G52 — Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes
SEMI G55 — Test Method for Measurement of Silver Plating Brightness
SEMI G56 — Test Method for Measurement of Silver Plating Thickness

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