SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages -

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Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
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Revision: SEMI G65-0318 - Inactive




This Test Method describes an evaluation method for bending characteristics of leadframe materials used for L-leaded packages.


This Test Method may be applied to leadframes for L-leaded packages such as QFP, SOP, TSOP, etc.


This Test Method may also be applied to any leadframe materials with thickness ≤0.15 mm.


The Test Method may be used in trim and form tool suppliers, leadframe material suppliers, leadframe manufacturers, and package engineers.



Referenced SEMI Standards


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