SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages
This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in March 2018; originally published in 1996; previously published August 2011.
This Test Method describes an evaluation method for bending characteristics of leadframe materials used for L-leaded packages.
This Test Method may be applied to leadframes for L-leaded packages such as QFP, SOP, TSOP, etc.
This Test Method may also be applied to any leadframe materials with thickness ≤0.15 mm.
The Test Method may be used in trim and form tool suppliers, leadframe material suppliers, leadframe manufacturers, and package engineers.
Referenced SEMI Standards
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