SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at and in March 2018; originally published in 1996; previously published August 2011.


This Test Method describes an evaluation method for bending characteristics of leadframe materials used for L-leaded packages.


This Test Method may be applied to leadframes for L-leaded packages such as QFP, SOP, TSOP, etc.


This Test Method may also be applied to any leadframe materials with thickness ≤0.15 mm.


The Test Method may be used in trim and form tool suppliers, leadframe material suppliers, leadframe manufacturers, and package engineers.


Referenced SEMI Standards


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