SEMI G66 - Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2017. Available at www.semiviews.org and www.semi.org in January 2018; originally published in 1996; previously published August 2011.

 

This Test Method describes a procedure for measuring the water absorption rate for plastic molding compounds and provides a method to calculate the diffusion and solubility coefficients, which are required to simulate the water absorption characteristics.

 

This Test Method may be applied to all semiconductor plastic molding compounds. This Test Method may be used to characterize molding compounds in development.

 

Packaging engineers may simulate the water absorption characteristics and their significance in relation to package cracks at soldering by using calculated diffusion and solubility coefficients.

 

Referenced SEMI Standards

None.

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