SEMI G66 - Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds -

Abstract

This Test Method describes a procedure for measuring the water absorption rate for plastic molding compounds and provides a method to calculate the diffusion and solubility coefficients, which are required to simulate the water absorption characteristics.

This Test Method may be applied to all semiconductor plastic molding compounds.

This Test Method may be used to characterize molding compounds in development.

Packaging engineers may simulate the water absorption characteristics and their significance in relation to package cracks at soldering by using calculated diffusion and solubility coefficients.

Referenced SEMI Standards (purchase separately)

None.

Revision History

SEMI G66-96 (Reapproved 0823)

SEMI G66-96 (Reapproved 0318)

SEMI G66-96 (Reapproved 0811)

SEMI G66-96 (Reapproved 1104)

SEMI G66-96 (first published)

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