G06800 - SEMI G68 - 空気環境における半導体パッケージのジャンクション部とケース間の熱抵抗測定の試験方法

Volume(s): Packaging
Language: Japanese
Type: Single Standards Download (.pdf)

本スタンダードは,global Assembly & Packaging Technical Committeeで技術的に承認されている。現版は201171日,global Audits and Reviews Subcommitteeにて発行が承認された。20118月にwww.semiviews.orgおよび www.semi.orgで入手可能となる。初版は1996年発行。前版は200411月発行。


注意: 本文書は,編集上の修正を伴い再承認された。




Referenced SEMI Standards

SEMI G30 — Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages

SEMI G32 — Guideline for Unencapsulated Thermal Test Chip

SEMI G38 — Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages

SEMI G42 — Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages

SEMI G43 — Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages

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