G06800 - SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on August 18, 2018. Available at www.semiviews.org and www.semi.org in March 2011; originally published in 1996; previously published August 2011.


The purpose of this Test Method is to determine the thermal resistance of semiconductor packages using thermal test chips. This Test Method deals with junction-to-case measurements of thermal resistance in air environment.


The results of this Test Method are used to obtain the junction temperature.


The measurement results are usually different from the results obtained by testing in the fluid bath environment described in SEMI G30 and SEMI G43.


This Test Method uses SI units.


Referenced SEMI Standards

SEMI G30 — Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
SEMI G32 — Guideline for Unencapsulated Thermal Test Chip
SEMI G38 — Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
SEMI G42 — Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
SEMI G43 — Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages

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