SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds -
Abstract
This Standard describes procedures for measuring adhesive strength between leadframes and molding compounds for semiconductor packages.
The procedures include shear test, pull test, and three-point bending techniques.
This Standard may be used on all types of semiconductor leadframe and molding compound.
The methods help leadframe manufacturers, molding compound manufacturers and their customers in evaluating leadframes, and molding compounds as a guideline.
The methods in this Standard use SI units.
Referenced SEMI Standards (purchase separately)
None.
Revision History
SEMI G69-0996 (Reapproved 0823)
SEMI G69-0996 (Reapproved 0318)
SEMI G69-0996 (Reapproved 0811)
SEMI G69-0996 (Reapproved 1104)
SEMI G69-0996 (first published)
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