SEMI G72 - Specification for Ball Grid Array Design Library

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)
Abstract

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in September 1997.

 

NOTICE: This Document was reapproved with minor editorial changes.

 

The purpose of this Specification is to promote industry use of common BGA designs that may be distinguished by their form, fit, function, and reliability requirements and to record designs by category that meet these requirements.

 

Subordinate Documents:

SEMI G72.1-0997 - Design Proposal for Ball Grid Array Design Library: 292 Pin Plastic Ball Grid Array

SEMI G72.2-0997 - Design Proposal for Ball Grid Array Design Library: 388 Pin Plastic Ball Grid Array

 

Referenced SEMI Standards

None.

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