SEMI G73 - Test Method for Pull Strength for Wire Bonding -

Abstract

1  Purpose
1.1  This Standard defines the pull strength test method for wire bonding.
2  Scope
2.1  This Standard defines the destructive pull strength test method and its criterion for evaluating pull strength of wire bonds connecting two points, connected by using ball bonding technique.
2.2  This Standard can be applied to measure wires whose diameter is less than 100 microns.
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Referenced SEMI Standards (purchase separately)
None
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

Revision History
SEMI G73-0519 (Reapproved 0526)
SEMI G73-0519 (technical revision)
SEMI G73-0997 (Reapproved 0811)
SEMI G73-0997 (Reapproved 1104)

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