SEMI G73 - Test Method for Pull Strength for Wire Bonding -
Abstract
This Standard defines the pull strength test method for wire bonding.
Referenced SEMI Standards
None.
Interested in purchasing additional SEMI Standards? Consider SEMIViews, an online portal with access to over 1000 Standards. |
Refund Policy: Due to the nature of our products, SEMI has a no refund/no exchange policy. Please make sure that you have reviewed your order prior to finalizing your purchase. All sales are final.
G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding
Sale price$187.00 USD
Regular price$150.00 USD (/)
This product has no reviews yet.