SEMI G74 - Specification for Tape Frame for 300 mm Wafers

Volume(s): Packaging
Language: English
Type: Single Standards Download (.pdf)

This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 11, 2014. Available at and in February 2015; originally published June 1998; previously published July 2006.


The purpose of this Document is to standardize the specifications for 300 mm wafer tape frames used between the dicing process and the die-bonding process.


This Standard documents the dimensions, characteristics, and measurement methods for 300 mm wafer tape frames.


This Standard can be used as the specification sheet for tape frame upon purchasing.


This Standard uses the SI unit system.


Referenced SEMI Standards


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